BalancedEtch™
A proprietary process which reduces surface defects by 1000x.
First, we prepare the wafers and epilayers.
We start with single-crystal diamond wafers. We treat these wafers to reduce defects, then grow high-quality diamond-on-diamond films with engineered dopant profiles.
Diamond Surface Treatment
Our surface engineering suite includes catCMP™ for achieving sub-nanometer surface roughness and SeamlessDiamond™ for high quality diamond epilayer growth.
Diamond Deposition
We grow doped-as-grown p-type, intrinsic, and n-type diamond epitaxial layers, leveraging precise calibration of dopant density and layer thickness to optimize performance for our microelectronic architectures.
Next, we fabricate all-diamond components.
We turn our engineered wafers into components with foundry-compatible, diamond-specific processes.
Device Patterning
Diamond compatible patterning processes using silicon foundry compatible tools for scalable production on scalable diamond wafer sizes.
Selective Diamond Etch
Our proprietary diamond-specific etch recipes create sub-micron features necessary for advanced all-diamond components such as on-wafer integrated circuits and components.
Metallization
Our proprietary diamond metallization is engineered to optimize all-diamond component performance and power metrics.
All to enable our diamond microelectronics product lines.
Diamond microelectronics enable smaller, lighter, and more powerful systems across defense, aerospace, energy, and quantum applications.
High Power RF Components
Built for extreme power and high frequency.
Our diamond RF components operate at temperatures 2–3x higher than state-of-the-art alternatives, enabling higher power density and smaller systems.
RF Diodes and Limiters
Engineered for exceptional power and high-frequency performance.
Operating Frequency:
S, C, X and higher frequency bands
Maximum Input:
10s W, 100s W and higher
Turn on voltage:
as low as 1.2V
We offer engineered products featuring all-diamond discrete RF diodes and all-diamond receiver protect solutions. Contact us for detailed data sheets or to discuss custom designs tailored to your needs.
Power Components
Compact, efficient power for weight‑critical missions.
Diamond power components deliver 3–4× higher output power. Operating at temperatures up to 500 °C, they reduce weight and improve efficiency by simplifying bulky cooling systems in weight-critical applications.
Power Diodes and Transistors
Operating Temperature:
up to 500 °C
Power Handling:
3-4x higher as compared to SiC
Turn on voltage:
as low as 1.2V
Contact us to explore custom designs tailored to your requirements.
Quantum Materials and Sensors
Powerful sensing with solid-state integration.
Our patent-pending quantum sensor uses PQuantumDiamond™ to deliver compact, solid-state environmental sensing with electric readout.
Quantum Materials
Our quantum materials portfolio includes surface engineering for ultra-smooth low-defect surfaces and growth of PQuantumDiamond™ films for high-performance sensing.
Quantum Sensors
Our patent-pending magnetic field sensor, based on PQuantumDiamond™ material swaps optical readout for integrated solid-state technology to enable stable, sensitive sensing in a compact package.
Contact us for the data sheets or to explore custom designs tailored to your requirements.
Radiation Sensors
From security to medical use, diamond sensors excel in tough environments.
Diamond’s solar-blind operation, radiation and high-temperature resilience, and low noise make it an exceptional sensor material. Our proprietary U.S.-manufactured doped diamond structures are engineered for specialized detection needs.
ClearXCam™
The Detector Module and Readout Electronics form the ClearXCam™ 2304 – a compact and easy-to-use in-beam imaging system. This system is effective for X-ray beamline scientists across various use cases: discovery of in-beam features, position monitoring, simplifying focusing events, and more.
Diamond Sensor Solutions
We provide diamond sensors in a variety of designs, including diode configurations for low-voltage applications, and proprietary sturdy metallization options for harsh environments.
Explore our diamond sensor catalog to view the full range of detectors. Contact us for more details or to discuss customized solutions tailored to your needs.
Surface Treatment and Diamond Deposition
We implement proprietary surface treatments to remove subsurface polishing damage and prepare diamond surfaces for high quality epiready diamond deposition for high performing diamond components.
Balanced Etch™
Diamond compatible etch process to remove subsurface polishing damage.
Orientation:
(1 0 0), (1 1 1) or polycrystalline
Surface Roughness:
comparable or less than the starting surface
Defect Reduction:
up to 103 cm-3
Contact us to share your requirements and explore collaborative opportunities.
cat-CMP
Diamond compatible chemical mechanical polishing achieves atomic roughness to make the diamond wafer surface ready for Epilayers.
Diamond Wafer size:
up to 2″
Orientation:
(1 0 0) and polycrystalline
Surface Roughness:
<0.5 nm
Contact us to share your requirements and explore collaborative opportunities.
Diamond Deposition
n-type (P doped) and intrinsic diamond epilayers with controlled doping concentration and thickness.
Growth method:
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Crystal Orientation:
(1 0 0) and (1 1 1) oriented diamond wafers.
Intrinsic Diamond:
50 nm – 10 µm, N impurities <1015 [N]/cm3
n-type (P doped) Diamond:
50 nm – 500 nm, doping concentration 1016 to 1020 [P]/cm3,
Contact us to share your requirements and explore collaborative opportunities.
Partnering with Leaders in Innovation
We partner with leading researchers, manufacturers, and integrators to advance all-diamond semiconductors for high performance and next-generation applications.
